FX-300tR
X-ray Imaging System for Electronic Component/Packaging Substrate
Examination of a double-sided board by conventional way
Auto-inspection of BGA
After inspection for full range of hidden BGA defect, BGA analysis provides the data.
FX-300tR can take 900X pictures. Compare it with the X-ray unit you are using.
Magnification ratio/price of X-ray unit
I-BIT method
I-BIT method
Ref. A's method For exam with an angle, X-ray tube & camera should not tilt.
Ref. A's method Take a picture by tilting X ray tube
Ref. B's method Tilting the board is NG.
Ref. B's method Tilting the board and taking an image NG.
SMD miniaturization / densification, advancing
Road Map: Electronic Components
