X-ray inspection · X-ray equipment
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X-ray Imaging System for Electronic Component/Packaging Substrate

Examination of a double-sided board by conventional way

Auto-inspection of BGA

After inspection for full range of hidden BGA defect, BGA analysis provides the data.

FX-300tR can take 900X pictures. Compare it with the X-ray unit you are using.

Magnification ratio/price of X-ray unit

I-BIT method

I-BIT method

Ref. A's method For exam with an angle, X-ray tube & camera should not tilt.

Ref. A's method Take a picture by tilting X ray tube

Ref. B's method Tilting the board is NG.

Ref. B's method Tilting the board and taking an image NG.

SMD miniaturization / densification, advancing

Road Map: Electronic Components